Harwin introduces three new shields that help control electromagnetic radiation

     To assist engineers in addressing EMI/RFI issues in board design, Harwin announced the launch of three new shielding products, which are available in roll and tape packaging, expanding Harwin's existing electromagnetic Compatibility (EMC) product range. The new shield sizes are 10mm x 10mm, 15mm x 10mm and 30mm x 10mm, each with a height of 3mm and a thickness of 0.15mm.

     All shields are made of a single piece of unplated nickel-silver alloy with a simple 5-sided shape. These cost-effective products feature Harwin's SMT shield clamps, which engineers can easily attach to the board. Since these fixtures are welded at the same time as the rest of the components on the PCB, secondary welding operations are avoided, while also eliminating the risk of damaging sensitive circuits due to exposure to extremely hot temperatures during manual welding.

     When rework, maintenance or component replacement is required, the removable shield can be easily connected to the devices and circuits below, and the shield can be simply removed and reinserted as needed, avoiding the very inconvenient soldering and solder cleaning procedures required for other types of EMC shields during rework.

     With the release of these new products, Harwin's EMI/RFI shielding range now covers sizes from 10mm x 10mm to 50mm x 25mm, heights from 2.5mm to 5mm, and material thicknesses from 0.15mm to 0.30mm. These off-the-shelf products are available in bulk directly from stock.

     Neil Moore, EMC and Industrial Product Manager at Harwin, said: "Controlling electromagnetic radiation is an important aspect of contemporary electronic design, especially for those that include wireless communications. "Harwin's easy-to-use shields and clamps have proved popular with electronics engineers, and now we offer a wider selection designed to help meet EMC requirements in the smallest handheld and wireless applications."