Hyperstone introduces a new SATA III SSD controller, Model X1

     Hyperstone has announced the availability of a new SATA III SSD controller, Model X1. The X1 is designed to meet the needs of the industrial sector, and the target product applications include high-reliability SSDS, M.2 and U.2 modules, system packages for CFast cards and eSSD, and flash drives for on-board controllers and flash chips. The initial X1 is available in 144-ball TFBGA (10.4 x 10.4 x 1.1 mm) and 124-ball TFBGA (9 x 9 x 1.2 mm) packages for applications in the industrial temperature range (-40 to +85 C).

     Based on the advanced hyMap technology based on the flash subpage conversion layer, the X1 achieves exceptional random write performance, minimal write amplification, and high durability without the need for external DRAM devices. The new FlashXE (Extended Endurance) technology features calibration, error correction for soft decoding, and error prevention mechanisms for a variety of flash memory particles including SLC, pSLC, 3D MLC, 3D TLC, and next-generation NAND flash.

     Relying on the exclusive hyReliability highly reliable flash management mechanism to ensure that the most stringent industrial requirements are met, hyReliability™ technology provides excellent balanced wear management, read and write interference management, and best-in-class and robust power outage management. At the same time, advanced radiation protection and soft error protection, including end-to-end data path protection, combined with SRAM ECC and low alpha particle packaging ensure stable operation under the most demanding conditions. The controller offers transfer speeds of up to 550MB /s and can deliver beyond S.M.A.R.T while providing lifetime estimation tools. A range of detailed health monitoring data.

     The X1 is Hyperstone's latest NAND flash controller addition, enabling industrial customers to benefit from its most reliable and energy efficient SSD solutions. Sandro-Diego Wolfle, product manager at Hyperstone, said that powerful dual-core processors, as well as end-to-end data path protection, FlashXE and advanced security features, are essential to ensure the stable operation of 3D flash on today's industrial systems. At the same time, X1 power consumption is extremely low, because the silicon chip junction temperature is designed at 125 degrees Celsius, X1 can be used in 105 degrees Celsius temperature environment.