Infineon Technology Co., Ltd. released a new generation of XENSIV MEMS microphone. New products include IM69D127, IM73A135 and IM72D128, which further expand Infineon's microphone product portfolio and set a new benchmark for the industry. These MEMS microphones with optional power modes are applicable to various consumer electronic products, such as headphones with active noise reduction (ANC) function, TWS headphones, conference equipment with beam forming function, laptops, tablets or smart speakers with voice interaction function. In addition, the product is also suitable for some industrial applications, such as pre lateral maintenance and safety.
These high-performance MEMS microphones are designed to capture audio signals with higher accuracy and sound quality. They use Infineon's latest sealed dual membrane (SDM) MEMS technology, with a protection level up to IP57. The design of the seal can prevent water or dust from entering between the diaphragm and the backplane, effectively avoiding the common mechanical blockage or leakage problems in MEMS microphones. Moreover, the microphone based on SDM technology can reach the highest protection level of IP68 with very little protection.
The analog microphone IM73A135 has an excellent acoustic overload point (AOP) of up to 73 dB (A) with best in class signal-to-noise ratio (SNR) and 135 dB SPL (sound pressure level). The signal to noise ratio of the digital microphone IM72D128 is 72 dB (A), and the acoustic overload point is 128 dB SPL (sound pressure level). The IM69D127 has similar performance, but uses a smaller 3.60 x 2.50 mm2 compact package. In addition, other features of the new generation of MEMS microphones include: all devices have extremely low distortion (THD) even at high sound pressure levels; The phase and sensitivity matching between components is very high, as well as flat frequency response, ultra-low group delay and optional power mode at low frequencies.
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