Infineon and Qualcomm work together to create high-quality standard solutions for 3D certification

     Infineon Technologies AG has partnered with Qualcomm to develop a 3D certified reference design based on the Qualcomm Snapdragon 865 mobile platform, further expanding the range of applications of Infineon's 3D sensor technology in mobile devices. This reference design uses the REAL3TM 3D time-of-flight (ToF) sensor to enable smartphone manufacturers to achieve standardized integration that is cost-effective and easy to design.

     For four years, Infineon has been active in the mobile terminal market with its 3D ToF sensor technology. Not only that, at the 2020 International Consumer Electronics Show (CES) in Las Vegas, Infineon unveiled the world's smallest (4.4mm x 5.1mm) and most powerful VGA resolution 3D image sensor. It meets the highest standards for outstanding facial recognition authentication, enhanced photo features, and authentic augmented reality experiences.

     Andreas Urschitz, President of Infineon's Power Management and Diversified Markets Division, said: "Today, the smartphone is more than just an information medium; it is increasingly taking on security and entertainment functions. 3D sensors can support new uses and more applications, such as secure identity authentication or payments through face recognition. We are deeply engaged in this market and have set clear growth targets. Working with Qualcomm to develop a reference design based on the REAL3 image sensor underscores our potential and ambition in this space." Infineon developed the 3D ToF sensor technology in collaboration with pmdtechnologies AG, which specializes in software and 3D time-of-flight systems.

     Starting in March 2020, Infineon's REAL3 ToF sensor will enable video bokeh on 5G smartphones for the first time, delivering the best image even in moving images. The application uses accurate 3D point cloud algorithms and software to process the received 3D image data. The 3D image sensor captures 940 nm infrared light reflected from the user and the scanned object. It also utilizes advanced data processing to enable accurate depth measurements. From strong sunlight environments to dim interiors, the patented "Background Illumination Suppression" (SBI) technology provides a wide range of dynamic measurements in any light condition. This ensures maximum robustness without compromising data processing quality.