Infineon introduces 1000A DC voltage regulator solutions for AI and 5G networks

     Infineon Technologies introduces the industry's first 16-phase digital PWM controller, the XDPE132G5C, further expanding its portfolio of chipset solutions for high-current systems. The product solution can provide 500-1000 A or higher power supply current for the new generation cpus, Gpus, FPgas and ASics used in high-end artificial intelligence (AI) servers and 5G data communication equipment.

     As CPU current requirements continue to increase to support the next generation of AI and networking workloads, DC-DC regulators (VR) need to deliver more than 500 A of current. With a 16-phase digital PWM engine and optimized advanced algorithms, the XDPE132G5C controller meets the power needs of these high-current polyphase applications. Active current sharing between phases of the power supply enables reliable, compact and cost-optimized designs. Not only that, it eliminates the need to configure additional multiple PWM logic doubling ics to achieve high current capabilities, as today's polyphase products typically do.

     In modern communication systems, ASics and FPGas using cutting-edge technologies generally require that the Vout control step size does not exceed 1 mV. This is the inherent feature of the XDPE132G5C, which allows Vout to be fine-tuned in 0.625 mV increments. In addition, it can meet the automatic restart requirements of communication equipment, in the event of a power or system failure, reducing the need for remote site maintenance.

     The XDPE132G5C comes in a 7mm x 7mm 56-pin QFN package with a maximum output of 16-phase PWM control signals. It is fully digitally programmable, PMBus 1.3 and AVSBUS compliant, and has full telemetry capabilities. Combined with the TDA21475, an integrated power stage with the highest efficiency and thermal performance in the industry, the XDPE132G5C controller is able to efficiently deliver over 1000 A current.

     Rated at 70 A, the TDA21475 power stage comes in a 5 mm x 6 mm package with an industry-leading efficiency of more than 95%. Thanks to the advanced moulded package, the successfully exposed top metal design significantly reduces the thermal resistance Rth (j-top) from 19°C/W to 1.6°C/W. Therefore, in practical applications, efficient heat dissipation can be achieved at the top of the package, resulting in superior power density design and optimized VR phase number and size. To maximize CPU/ASIC functionality, the TDA21475 also provides intelligent overcurrent and overvoltage protection, and can provide accurate real-time temperature and current information to the XDPE132G5C controller.

     The 10-phase PWM digital controller IR35223 further completes Infineon's portfolio of high-current chipset solutions. It is A cost-effective option for VR solutions with current requirements up to 500 A. The IR35223 is available in a 6 mm x 6 mm, 48-pin QFN package with advanced transient control performance and telemetry, in line with PMBus 1.3/AVSBUS bus standards.