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Infineon introduces 3D image sensor solutions for the mobile device market

Dec 3 2019 2019-12 Sensors Infineon Technologies
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Infineon Technologies AG has developed an excellent 3D image sensor solution for the mobile device market, the REAL3™ IRS2381C. Today, the 3D Time of Flight (ToF) single-chip solution has been named "Product of the Year" in the Sensor category by the Embedded Vision Alliance.

     Infineon Technologies AG has developed an excellent 3D image sensor solution for the mobile device market, the REAL3™ IRS2381C. Today, the 3D Time of Flight (ToF) single-chip solution has been named "Product of the Year" in the Sensor category by the Embedded Vision Alliance. The awards recognize innovations and significant achievements in advanced technologies, services and products that drive the adoption of the next generation of computer vision technology in a wide range of industries.

 

     "Congratulations to Infineon for winning the Embedded Vision Alliance Sensor of the Year 2019 award," said Jeff Bier, founder of the Embedded Vision Alliance: "It is innovative sensor designs like Infineon's 3D Image sensor that enable people to truly experience new 3D vision technologies such as smartphone face recognition and augmented reality. When it comes to 3D image sensors for visual artificial intelligence applications, Infineon is a leader. I really appreciate their relentless investment in innovating and building high-quality products in this complex and rapidly changing market. I am proud and proud that Infineon is a member of the Embedded Vision Alliance, and I am delighted that they have received this award."

 

     Philipp von Schierstaedt, Vice President and Head of RF and Sensors at Infineon, said: "We are very grateful to the Embedded Vision Alliance for awarding us the 'Product of the Year' award, which is a recognition of the innovation and excellent performance of Infineon's REAL3™3D ToF image sensors. "The new sensor combines the expertise of Infineon and pmdtechnologies to further enhance 3D photography for mobile device applications, enabling a unique user experience in secure face recognition, computational photography and seamless augmented reality applications."

 

     Time-of-flight (ToF) is currently the most advanced image sensing technology, which has driven the adoption of 3D cameras in the new generation of mobile devices and will drive the rapid growth of the 3D image sensing application market in the coming years. "Time of flight" refers to the time it takes for a photon to travel from the camera to an object or target and then back to the REAL3 sensor. Behind this principle lies a remarkable innovation: it enables a more secure user interaction with the smartphone.

 

     The award-winning IRS2381C image sensor delivers a high-quality, safe, real-time 3D visual experience with superior performance in all lighting conditions, including outdoors. Compared to other 3D technologies, such as structured light, Infineon's 3D time-of-flight technology reduces key components from three to two. In addition, by supporting direct distance measurement, it minimizes the computational resources required by the application processor. All in all, the solution improves reliability, reduces size, and is more cost competitive, while also significantly reducing power consumption.

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