Infineon introduces EasyPACK™ CoolSiC™ MOSFET modules for fast switching applications in ESS

     Infineon Technologies AG introduces the new EasyPACK™ 2B module. A product of Infineon's 1200 V family, the module features an active clamp three-level (ANPC) topology and integrates CoolSiC™ MOSFETs, TRENCHSTOP™ IGBT7 devices, NTC temperature sensors and PressFIT crimp pins. Suitable for fast-switching applications such as energy storage systems (ESS), the power module also helps increase the power rating and energy efficiency of solar systems and meets the increasing demand for 1500 V DC-link solar systems.

     Designed to operate across the entire power factor (cos φ) range, the Easy module F3L11MR12W2M1_B74 uses state-of-the-art CoolSiC MOSFET and TRENCHSTOP IGBT7 technology with higher diode ratings. In energy storage applications, a single module per phase can achieve up to 75 kW of power. For solar applications, two modules per phase in parallel can achieve up to 150 kW.

     Thanks to improved pin position, the module also ensures a short and interference-free converter loop to reduce module stray inductance. The CoolSiC MOSFET chip in the EasyPACK 2B package achieves superior heat transfer performance through optimized layout. In addition, it facilitates easy system design and supports highly flexible and free inverter design.