Infineon introduces a new vehicle-scale laser driver IC

     3D depth sensors play an important role in in-vehicle monitoring systems, enabling innovative automotive cabins, seamless connectivity to new services, and greater passive safety. They are essential for meeting the requirements and safety ratings of the European New Car Assessment Programme (NCAP), as well as for achieving superior comfort features.

     Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has developed the highly integrated IRS9103A vertical cavity surface-emitting laser (VCSEL) driver integrated circuit (IC) specifically for automotive applications. Combined with Infineon's REAL3 image sensor, this vehicle-graded laser diode driver IC enables a smaller, less costly and more powerful 3D camera module design.

     Andreas Kopetz, Vice President of Environmental Sensing product line at Infineon Technologies, said: "Standard products in consumer electronics can also be used for automotive time-of-flight (ToF) applications. Now only one component can replace the four discrete key components that originally drive the laser lighting source. This not only simplifies the design to a greater extent, minimizing material usage and module size, but also improves performance and robustness."

     The driver IC integrates the low voltage differential signal (LVDS) receiver, gate driver and switching element in a 1.35 x 1.35 mm² microwafer-level package and complies with AEC-Q100 Level 2 standards. The IC can be powered entirely from the existing 3.3V imager power supply, eliminating the need to add a 5V voltage rail to the discrete gate driver. The product supports 10 A driver current and 14 V laser diode voltage to drive two three-junction VCsels at modulation frequencies up to 130 MHz. Built-in fail-safe mechanisms, such as undervoltage and overheat protection, and the combination of a pulse width modulator with Infineon's REAL3™ image sensor provide the ideal package for an eye-safe 3D ToF camera module.

     In addition to reducing the footprint of the board, the reduction of four AEC-Q100 compliant key components to one brings other benefits, such as simplified design and reduced development effort. In addition, the new products reduce component tolerances, making the conversion between electrical and optical properties more efficient and robust, and improving supply reliability.