Infineon introduces flip chips specifically for automotive applications

     Infineon Technologies is now moving towards the smallest automotive electronic power supply. Infineon, as the first chip manufacturer, created a specialized flip-chip packaging production process that fully meets the high quality requirements of the automotive market. Infineon now offers its first product: the OPTIREG™ TLS715B0NAV50, a linear voltage regulator. With flip chip technology, the IC can be installed upside down in the package. By having the front of the heated part of the IC face towards the bottom of the package and close to the PCB, thermal conductivity can be improved by 2-3 times. Compared to traditional packaging technology, its higher power density greatly reduces the product size.

     Infineon's new linear regulator (in the TDP-7-8 package, 2.0 mm x 2.0 mm) is more than 60% smaller than the existing reference product (in the TSON-10 package, 3.3 mm x 3.3 mm), while retaining the same thermal resistance. This makes the new device particularly suitable for applications where board space is very limited, such as radar and cameras. OPTIREG™  TLS715B0NAV50 has a voltage of 5V and a maximum output current of 150 mA.

     Flip chip technology has been used in consumer and industrial markets for several years. Given today's increasingly demanding space requirements (especially with the increasing number of radars and cameras), automotive electronics also have a need for smaller power solutions - but with higher quality requirements. In order to provide top-notch flip chip quality, Infineon does not rely on subsequent certifications for existing consumer and industrial products, but on a dedicated production process for automotive components.