Infineon introduces the combined AIROC Wi-Fi 6/6E and Bluetooth 5.2 series for iot and streaming devices

The combined Wi-Fi 6/6E solution operates in the new 2.4 GHz, 5 GHz and 6 GHz bands to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications such as game consoles, AR/VR, smart speakers, media streaming devices, and automotive infotainment systems. Applications that require real-time response, such as security systems and industrial automation, will also benefit from Infineon's new offerings.

Infineon's AIROC Wi-Fi 6/6E certified solution goes well beyond the standard requirements to enhance the user experience through advanced wireless technology and architectural innovation, and provides the following benefits:

● Double the wireless coverage compared to Wi-Fi 5 and Wi-Fi 4;

● 40% higher coverage than typical Wi-Fi 6/6E solutions;

● Improved connection reliability with enhanced interference suppression;

● Lower latency and better Wi-Fi/BT coexistence for improved multimedia streaming and gaming responsiveness in complex network environments;

● Power saving more than 20%, thus extending the battery life;

● Multiple layers of security with secure boot, firmware authentication and encryption, and lifecycle management bring a higher level of security to iot applications.

Vikram Gupta, Senior Vice President, iot Computing and Wireless at Infineon, said: "The combined AIROC Wi-Fi 6/6E solution solves the problem of 2.4 GHz and 5 GHz channel congestion, bringing superior audio and video quality to media applications and powerful remote connectivity for iot applications."

The Infineon AIROC Wi-Fi 6/6E solution is also equipped with the latest Bluetooth 5.2 technology, enabling high quality audio with LC3 and supporting new BLE audio use cases such as audio sharing and audio broadcasting. The unique Wake-on-Bluetooth LE mode allows the host CPU to autonomously "listen" for incoming connection requests while reducing power consumption. The solution incorporates advanced wireless technology innovations to improve BT/BLE range, durability, latency and power saving beyond standard BT5.2. Infineon's unique Smart Coex™ maximizes Wi-Fi throughput in coexistence with Bluetooth and optimizes demanding multimedia applications.

Infineon's module partners enable rapid development, reduced testing costs and product certification when creating integrated Wi-Fi 6/6E solutions. Akira Sasaki, General Manager of Murata, said: "By partnering with Infineon, we are able to leverage our combined expertise to develop innovative Wi-Fi solutions, further strengthening our market leading position. Our most recent collaboration is the Wi-Fi 6/6E CYW5557x module, which provides advanced technology integration, superior network quality, and reduced time to market. In addition, it can be delivered through Murata's extensive sales and distribution channels."

Insoo Ryu, Head of the Automotive Components and Electronics Division at LG Innotek, said: "LG Innotek is pleased to collaborate with Infineon on the development of the new Wi-Fi 6E communication module with the CYW89570 chip. This module extends LGIT's automotive/industrial-grade product range to a new generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to the automotive platform."

For automotive applications, u-Blox uses Infineon's Wi-Fi 6E combo solution to build industrial modules that comply with the AECQ100 standard. Hakan Svegerud, Senior Director of Product Strategy at u-Blox, said: "At u-Blox, we are excited to partner with Infineon on the development of the new CYW89570 chip. Based on these solutions, we will expand our successful JODY module family with global automotive and industrial-grade modules to provide customers with cutting-edge technologies including Wi-Fi 6, Wi-Fi 6E and Bluetooth 5.2."

Yu Zongyuan, Executive Director and general manager of nFore Technology, said: "The NF3327PQ combination module of Anfore is built with Infineon's CYW89570 chipset. Infineon's CYW89570 chipset is the perfect chipset to enable the application of Wi-Fi 6 and Bluetooth 5.2 technology for automotive customers."