Infineon introduces the fourth-generation REAL3 image sensor

     Infineon presents the fourth-generation REAL3 image sensor IRS2771C. The 3D Time of Flight (ToF) single-chip device is designed to meet the needs of the mobile consumer end market, particularly the need to support higher resolutions with small lenses. A wide range of applications include secure user authentication (such as face recognition or hand recognition) to unlock devices and confirm payments. In addition, the 3D ToF chip helps improve augmented reality, image morphing and photo effects (such as bokeh), and can be used to scan rooms.

     The image sensor measures just 4.6 x 5 mm and has a 150 k (448 x 336) pixel output close to HVGA standard resolution. This gives it a resolution four times higher than most ToF solutions on the market today. Its pixel array is highly sensitive to 940 nm infrared light, resulting in unmatched outdoor performance. This is achieved through a patented "background illumination suppression" (SBI) circuit at each pixel. Due to its high level of integration, each IRS2771C image sensor is more or less a tiny monolithic ToF camera. This greatly reduces bill of material costs and the actual size of the camera module without compromising performance and minimizing power consumption.

     Philipp von Schierstaedt, Vice President and head of the RF and Sensors business at Infineon, said: "The durability of this image sensor in ambient light and its energy savings make it an unrivaled product on the market. With a new generation of image sensors, Infineon can further strengthen its leading position. "With this new REAL3 chip, every terminal manufacturer will be able to increase the value of their devices, customize the design and accelerate the pace of bringing products to market."

     Through its long-standing collaboration with pmdtechnologies, Infineon has gained in-depth knowledge in the processing of 3D point cloud algorithms (a set of spatial data points generated by 3D scanning). As a result, in addition to Infineon's hardware expertise, customers receive a full range of services, including tools and software. Bernd Buxbaum, CEO of pmdtechnologies, said: "This fruitful collaboration fully demonstrates that only by designing a depth sensing system from the ground up, including cutting-edge ToF pixels, image sensors, module design, advanced signal processing and other aspects, can a first-class three-dimensional ToF system be achieved. Our customers can take advantage of pmd's 15 years of experience developing and manufacturing best-in-class 3D ToF products."