Infineon introduces the new Industrial CoolSiC™ MOSFET 650 V G2 in Q-DPAK and TOLL packages for higher power density

     The electronics industry is rapidly transitioning to more compact and powerful systems. To support this trend and further drive system-level innovation, Infineon Technologies AG, the global semiconductor leader in power systems, automotive and the Internet of Things, is expanding its CoolSiC™ MOSFET 650 V single-tube product portfolio with the introduction of two new product families in Q-DPAK and TOLL packages.

     With top and bottom cooling and based on CoolSiC™ Generation 2 (G2) technology, both product families offer significant improvements in performance, reliability and ease of use. They are specifically designed for medium to high power switched mode power supply (SMPS) development, including AI servers, renewable energy, charging piles, electric vehicles and humanoid robots, televisions, drives, and solid-state circuit breakers.

     The TOLL package features excellent on-board thermal cycling (TCoB) capabilities, enabling compact system designs by reducing the printed circuit board (PCB) footprint. It also reduces system-level manufacturing costs when used in SMPS. TOLL packages are now available for more targeted applications, enabling PCB designers to further reduce costs and better meet market demands.

     The Q-DPAK package complements the new top cooling (TSC) products under development at Infineon, including CoolMOS™ 8, CoolSiC™, CoolGaN™ and OptiMOS™. TSC products enable customers to achieve excellent robustness and greater power density and system efficiency at low cost, as well as increase direct heat dissipation to 95%, better manage space and reduce parasitic effects by enabling two-sided use of the PCB.