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Infineon launched the industry's first radiation resistant NOR flash memory meeting the QML-V standard for aerospace grade FPGAs

Jul 21 2022 2022-07 Semiconductors Infineon Technologies
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Infineon Technologies LLC, a unit of Infineon Technologies Inc., has launched the industry's first High Capacity Radiation-resistant (RadTol) NOR flash memory product with MIL-PRF-38535 QML-V process certification. The QML-V process is certified to the highest quality and reliability standards for aerospace grade ics.

     Space grade programmable logic devices (FPGAs) need reliable, high-capacity nonvolatile memories containing their boot configurations. To meet the growing demand for highly reliable memory, Infineon Technologies LLC, a subsidiary of Infineon Technologies, announced the launch of the industry's first high-capacity radiation resistant (RadTol) NOR flash memory product, which passed the MIL-PRF-38535 QML-V process certification. QML-V process is the highest quality and reliability standard certification of aerospace grade IC.


     Infineon's 256 Mb and 512 Mb RadTol NOR Flash nonvolatile memories can bring excellent low pin count single-chip solutions, which are suitable for FPGA configuration, image storage, microcontroller data and boot code storage and other applications. When used at a higher clock rate, the device supports data transmission comparable to or beyond traditional parallel asynchronous NOR flash memory, while significantly reducing the number of pins. The radiation resistance of this device is up to 30 krad (Si) bias and 125 krad (Si) unbiased. At 125 ° C, the durability of this device reaches 1000 programming/erasing cycles, and the data retention period is 30 years. At 85 ° C, it can reach 10000 programming/erasing cycles, and the data retention period is 250 years.


     As the leader of aerospace grade memory products, Infineon developed RadTol 256 Mb Quad SPI (QSPI) and 512 Mb Dual Quad SPI NOR Flash using 65 nm floating gate flash memory technology. Both have 133 MHz SDR interface speed. The 512 Mb device consists of two independent 256 Mb chips, which are assembled side by side with a single packaging solution. In this way, designers can flexibly run devices independently in dual QSPI or single QSPI mode on any chip, thus providing them with the option of using the second chip as a backup solution. Infineon is working closely with leading FPGA ecosystem companies such as Xilinsi on aerospace applications.


     Helmut Puchner, vice president of aerospace and defense business of Infineon Technologies LLC, said, "Our radiation resistant dual QSPI nonvolatile memories are fully supported by the latest aerospace class FPGAs. They can bring excellent low pin count single chip solutions to configure processors and FPGAs. For example, Xilinx Kintex ® UltraScale ™ The entire image of XQRKU060 can be loaded in about 0.2 seconds in Dual Quad mode. "

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