KEMET introduces new tantalum polymer capacitors for applications requiring high capacitance and high voltage

     KEMET continues to develop and design solutions for alternative energy, industrial/lighting, medical, defense and aerospace, and telecommunications applications with its new tantalum Stacked polymer (TSP) O 7360-43 and 82μF/75V rated voltage expansion capacitor family in polymer gas-tight packaging.

     The TSP series features an innovative stacked construction designed to provide the highest capacitance/voltage (CV) rating in surface mount device (SMD) capacitors. These new capacitors are manufactured in specific sizes and are ideal for high voltage power management applications such as lift converters, filtering, holding capacitors, and other large ripple current applications that require small size, stable performance, and long service life.

     Kimi Electronics' KO-CAP  high-reliability series T540, T541 and T543 can be stacked in the TSP series. These capacitors, when stacked, allow design engineers to customize capacitance, voltage, and low ESR (equivalent series resistance). This capability makes the TSP family ideal for devices using gallium nitride (GaN) semiconductor technology, including radar applications based on active electronically Scanned array (AESA) systems. The TSP series also offers improved derating conditions and larger capacitors to ensure low failure rates at typical voltage levels, as well as multiple failure rate scenarios when using stack configurations for the T540 and T541 series.

     The TSP family is suitable for many applications, including airborne, ground and naval equipment, where GaN radio frequency (RF) semiconductors are part of the design. According to a report released by Yole Developpement in May 2020, the total defense market for GaN radio frequency (RF) applications is expected to grow at a compound annual growth rate (CAGR) of 22% to exceed $1 billion by 2025, while the total market for GaN RF will exceed $2 billion by 2025.

     The report also states that applications in radar active phased array (AESA) systems and the need for lightweight equipment for airborne systems are the main drivers of the GaN RF defense market. In addition, the TSP family can fully support other high-power, high-frequency and long-life requirements in telecommunications and industrial applications.