Laird Connectivity's new Sterling LWB+module. This Wi Fi 4 (802.11b/g/n) and Bluetooth 5.2 low-power device is designed for the next generation of Internet of Things (IoT) products, such as battery powered medical devices, industrial IoT sensors, durable handheld devices and other connectivity solutions.
The Laird Connectivity Sterling LWB+module adopts the Infineon AIROC CYW43439 chipset solution, which can meet the reliability and security requirements in the industrial Internet of Things scenario, and can work in the full industrial temperature range of - 40 ° C to+85 ° C. This high-performance SDIO security solution integrates a fully functional Wi Fi 4 radio module, with a variety of software drivers and support, and can be easily integrated with any Linux or Android based system. These modules are mechanically and pin compatible with Sterling LWB modules and can easily upgrade existing designs.
The Sterling LWB+module supports the new WPA3 safety standard, and the integrated power amplifier and low noise amplifier (LNA) ensure reliable connectivity, even in challenging RF environments. Sterling LWB+device can carry onboard chip antenna or MHF connector for external antenna, which can connect a series of internal antennas certified by Laird Connectivity. In order to facilitate development and evaluation, Trader also provides Sterling LWB+development kit that can carry onboard chip antenna or MHF connector. These modules have passed FCC, ISED, CE, UKCA, RCM, MIC and Bluetooth SIG certification, further accelerating the speed of product launch.
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