Laird Thermal Systems announces the launch of a new line of micro-thermoelectric chillers for next-generation optoelectronic devices

     Laird Thermal Systems announced the expansion of its product line of micro-thermoelectric chillers with the introduction of the OptoTEC™ MBX family for space-constrained, high-performance optoelectronics applications. The MBX series uses next-generation thermoelectric materials and advanced automated processes TO provide standard and custom options for TEC used in applications such as To-CAN, TOSA and Butterfly packaging. One of these innovations is the ability to achieve a more compact form factor, with the smallest models being as small as 1.5 x 1.1mm and thickness as thin as 0.65mm, ensuring even greater cooling performance with the lowest possible power consumption despite specific space constraints.

     The MBX series has a high heat pump density of up to 43 W/cm2 and can achieve a temperature difference of up to 82 ° C at 50 ° C ambient temperatures. The MBX series ensures efficient thermal management and precise temperature control to protect a wide range of optoelectronic devices operating in high temperature environments, including laser diodes, optical transceivers, liDAR, infrared (IR) sensors and high-power indium phosphide (InP) VCsels.

     Andrew Dereka, Director of Thermoelectric Products at Laird Thermal Systems, said: "The optical communications industry is rapidly moving forward, driven by applications such as artificial intelligence and machine learning, requiring very high temperature stability for laser diodes in high-speed optical transceivers. The MBX series is the ideal solution to ensure that optical devices maintain consistent wavelengths, reduce temperature drift and extend service life. Our significant investment in highly accurate, fully automated production lines reflects our commitment to process control, high-volume capacity and high reliability."

     The MBX series has been subjected to rigorous Telcordia GR-468 CORE testing to ensure excellent reliability and long service life even in harsh environments, meeting the higher qualification and reliability standards of the optoelectronics market. The MBX series can be customized to meet specific requirements such as form factor, heat pump density and cooling efficiency. This series of solder structures can support reflow temperatures up to 280 ° C and wire welding for a wide range of optoelectronic applications. Laird Thermal Systems are also available in a variety of special surface treatment options, including gold plating patterns, thermistor attachments and seals to suit those that are not sealed.