MACOM offers a full range of trans-resistance amplifiers covering 100G to 800G applications

     MACOM Technology Solutions, Inc., a leading provider of semiconductor solutions, announced the launch of two new transresistance amplifiers (TIAs), both optimized for optical networking applications, with coverage ranging from 100Gbps DR1 to 800Gbps DR8 and FR8. The new TIA is now available with flip-chip and lead bonding package options for fast and flexible deployment in QSFP, QSFP-DD and OSFP optical modules.

     Given the trend towards single-channel 100G and multi-channel 200G, 400G and 800G connectivity, there is an increasing demand for high-performance, energy-efficient optical components to maximize bandwidth density in cloud data centers. MACOM's expanded TIA family, combined with seamlessly interoperable MACOM components, will help customers accelerate this transition with our comprehensive portfolio.

     MATA-05817 has low noise performance below 2 uA RMS (typical value) and supports bandwidth up to 35 GHz. TIA supports high-throughput optical data links in an extremely low-power configuration and is best suited for high-density optical data center interconnects. The device is suitable for 50G, 100G, 200G and 400G receivers using multilevel modulation such as PAM4.

     The MATA-38134 is a four-channel 26/53GBaud linear PAM4 TIA with automatic gain and integrated AGC loop. TIA has extremely low power consumption and is primarily aimed at single-mode fiber applications. The TIA's anode-to-anode pitch is 500um, which allows customers to place two sets of devices within the QSFP-DD size specification for 800Gbps applications.Both devices include RSSI for optical alignment and power monitoring, as well as I2C controls for bandwidth, output amplitude, peak, LOS, gain, and other parameters.