MOSFET components for automotive powertrain applications

     Nexperia has introduced the Low RDS(on) 40 V AEC-Q101 MOSFET product line, which targets space-constrained, high-power modules in powertrains. The device is packaged in a miniature LFPAK33 with a space area of only 10.9 mm² and a pitch of only 0.65 mm, using Nexperia's Trench 9 technology. This results in a 48% lower RDS(on) parameter than the previous process, covering a wide range of applications from 30 W to 300 W. The RDS(on) of BUK7M3R3-40H and BUK9M3R3-40H (standard and logical) components is only 3.3 mΩ.

     The improved RDS(on) and current capabilities enable the LFPAK33 to replace larger power modules at a lower cost and with similar performance, while traditional DPAK package components are up to 80% larger than existing LFPAK33 packages. The powerful Trench 9 overjunction technology also provides higher avalanche capability and a larger safe operating area (SOA) for improved performance under failure conditions.

     Richard Ogden, Nexperia Product Manager, said: "Automotive design engineers need to constantly innovate - especially in applications such as water, fuel and oil pumps and engine filters - with a focus on reducing module size in the face of increased power requirements. Thanks to the unique LFPAK package technology that absorbs thermal stress, our Trench 9 Automotive grade LFPAK33 MOSFET components are ideal for these highly thermal powertrain systems. Other automotive applications include parking braking, airbag systems, LED lighting, seat control and heating, window lifting and driver infotainment systems."

     Nexperia's LFPAK33 40 V MOSFET family represents the industry's most complete product range in 3x3 mm packages, with 16 standard and logic components. These components are compliant with the AEC-Q101 standard and exceed its standard requirements by more than two times.