Melexis Launches New 3D Magnetic Position Sensor Chip

     Melexis announced the introduction of MLX9042x series, adding new members to its 3D magnetic position sensing solution. This series of sensor chips are designed for cost conscious automotive customers, and can accurately and safely measure absolute position in harsh and noisy environments and a wider temperature range   

     The solution is mainly applied to automobile customers, including power system actuators, transmission sensors, pedal position sensors and chassis sensors. Industrial customers will also benefit from the functional improvements they bring.
The MLX9042x device is based on the Triaxis Hall sensor technology pioneered by Melexis and is equipped with functions such as analog signal conditioning, data conversion, signal processing and output stage driver.

     The performance of MLX9042x series is similar to that of MLX9037x series products, which can ensure the success of EMC testing. Users only need one test cycle to complete the test, thus speeding up the design process and reducing costs. The higher absolute maximum rating (AMR) can provide multiple protections including reverse polarity, reduce quality accidents caused by electrical overstress and meet various OEM requirements.

     These devices comply with ISO26262 ASIL B standard, can meet the design requirements of functional safety actuators and sensors, and can ensure the safe operation of the vehicle. In addition to the single chip version, MLX9042x also provides a dual chip version, which is suitable for applications requiring higher security and reliability.

     Another key advantage of the MLX9042x series is that it supports an operating temperature of 160 ℃. This high temperature resistance can realize position sensing in high temperature environment, such as small engine compartment or environment where heat penetration increases due to start and stop. MLX9042x devices launched by Melexis have passed AEC-Q100 certification. Users can select SMD packaging, or SMP-3 and SMP-4 PCB free packaging (where sensor chips and EMC capacitors are integrated in the same mold).