Microchip introduces a new line of high-speed analog-to-digital converters (ADCs)

Microchip's announcement of the MCP37Dx1-80 series fills this gap. Microchip's second streamline ADC is the industry's first with 80 MSPS sampling rates, 12 -, 14 - and 16-bit resolution options, integrated digital capabilities for higher temperature ranges, and is currently certified by the Automotive Electronics Council (AEC) Q100.

For system designers, there is a limited choice of small, reliable, feature-rich high-speed ADCs currently available for use in extended-stage temperature environments. Microchip Technology Inc. (MICROCHIP) today announced the MCP37Dx1-80 series to fill this gap. Microchip's second streamline ADC is the industry's first with 80 MSPS sampling rates, 12 -, 14 - and 16-bit resolution options, integrated digital capabilities for higher temperature ranges, and is currently certified by the Automotive Electronics Council (AEC) Q100.

Bryan Liddiard, vice president of Mixed Signal and Linear Products at Microchip, said: "Our latest ADCs meet our customers' growing demand for robust devices that can be used in high-temperature applications, provide integrated digital processing capabilities, simplify design and reduce overall development costs. "The addition of the MCP37Dx1-80 series to Microchip's 200 MSPS ADC portfolio greatly expands the scope of our products in system design concepts."

Microchip's MCP37Dx1-80 ADC products meet the requirements of a wide range of high-reliability aerospace and defense, industrial and automotive systems. Key features of the new ADC devices include:

● Robust design architecture: The new ADC devices operate from -40°C to +125°C, making them one of the few high-speed ADCs in the industry to comply with AEC-Q100 Class 1 standards. This makes them ideal for demanding applications such as advanced driver assistance systems (ADAS), autonomous driving, low Earth orbit (LEO) satellites, and test and measurement equipment.

● Integrate digital functions to eliminate external components and reduce post-processing requirements for single chip microcomputer (MCU) : the decimation filter improves the signal-to-noise ratio (SNR), the digital downconverter (DDC) supports communication design, and the noise shaping requantizer in the 12-bit ADC improves accuracy and performance.

● Small size: a compact 8 mm x 8 mm 121 pin ball grid Array (BGA) package with a pitch of 0.65 mm; Built-in reference decoupling capacitors further reduce cost and overall size by eliminating the need for external bypass capacitors.