Microchip introduces the SP1F and SP3F power module portfolio for crimp terminals

     The electric vehicle, sustainability, and data center markets require products that are easy to manufacture in high volumes. To better automate the installation process, the industry often uses press-fit terminals because they provide a solderless solution for mounting power modules onto printed circuit boards. Microchip Technology announced the introduction of its SP1F and SP3F power module portfolio with crimp terminals to support high-volume applications.

     Welderless crimped power module terminals allow automated or robotic installation, simplifying and speeding up the assembly process and reducing manufacturing costs. The SP1F and SP3F power modules have high precision terminal points and a novel crimp pin design for highly reliable contact with the printed circuit board. Overall, crimp power module solutions save valuable time and production costs.

     Microchip's SP1F and SP3F power module portfolio is available in more than 200 models using mSiC technology or Si semiconductors, as well as a range of topologies and ratings. The SP1F and SP3F voltage ranges from 600V-1700V with current up to 280A.

     By using the crimp technology, the power module pins are not welded to the printed circuit board, but are electrically connected by pressing the pins into the appropriately sized PCB holes. One of the main advantages of crimped power module solutions is that wave soldering is not required. This is especially important when the printed circuit board also includes surface mount technology (SMT) components.

     Leon Gross, Microchip's corporate vice president of Discrete Products, said: "Our introduction of power modules with crimp-fitted terminals gives customers the flexibility of fully customized design and is a cost-effective power solution for high volume production. This power solution is plug-and-play and provides a highly reliable installation solution for automated or robotic assembly."