Micron Technology samples the industry's new uMCP packaging products with LPDDR5

     Micron Technology announced the beginning of the industry's first Universal Flash Memory (UFS) multi-chip package (uMCP) product that also features low-power DDR5 (LPDDR5) DRAM. This uMCP product provides a high-density, low-power storage solution for thin and compact mid-range smartphone designs.

     Micron's new uMCP5 package incorporates the company's innovation and cutting-edge technology in multi-chip packaging, integrating low-power DRAM, NAND, and on-board controllers to take up 40 percent less space than dual-chip solutions. This optimized architecture reduces power consumption, reduces memory chip size, and enables smaller, more flexible smartphone designs.

     Dr. Raj Talluri, senior vice president and general manager of Micron's Mobile Products Group, said: "This industry-first uMCP5 package solution connects the new LPDRAM and UFS, increasing memory and storage bandwidth by 50% while delivering lower power consumption. "This product enables mid-range 5G smartphones to operate in ultra-low latency response times and low power consumption modes, enabling them to support a variety of features found in flagship smartphones, such as multiple high-resolution cameras, multiplayer gaming and AR/VR applications."

     The Micron uMCP5 uses advanced 1y nanometer DRAM process technology and the world's smallest 512Gb 96-layer 3D NAND bare chip. The 297-pin Ball Grid Array (BGA) package supports dual-channel LPDDR5 at speeds up to 6,400Mbps, a 50% performance improvement over the previous generation interface. The new package also offers the highest storage and memory density for uMCP5 on the market today, at 256GB and 12GB respectively.

     uMCP5 provides the ideal solution for Micron LPDDR5 DRAM. 5G networks will begin large-scale deployment around the world in 2020, and Micron's next-generation LPDDR5 memory can meet its needs for higher memory performance and lower power consumption, while allowing 5G smartphones to process data at speeds of up to 6.4Gbps, which will play a crucial role in solving data processing bottlenecks.