Micron introduces the industry's leading compact UFS to power the next generation of smartphone designs with larger batteries

     Micron Technology has announced the start of shipping an enhanced Universal Flash Memory (UFS) 4.0 mobile solution featuring breakthrough proprietary firmware features and an industry-leading compact UFS package (9 x 13mm). Based on advanced 232-layer 3D NAND technology, Micron's UFS 4.0 solution can achieve up to 1 TB of capacity, and its superior performance and end-to-end technology innovation will enable faster response and a more responsive experience for flagship smartphones.

     Micron UFS 4.0 delivers sequential read and sequential write speeds of up to 4,300 MBps and 4,000 MBps, respectively, doubling the performance of its predecessor and providing a better experience for data-intensive applications. With high-speed performance, users can launch common productivity, creative and emerging AI applications faster. Large language models in generative AI applications load up to 40% faster, providing a smoother user experience for conversations with AI digital assistants.

     Mark Montierth, general manager and corporate vice president, Micron Mobile, said: "Micron's latest UFS 4.0 solution features an industry-leading compact UFS package that delivers best-in-class storage performance while reducing power consumption. "With breakthrough firmware updates, the solution keeps smartphones running as smoothly as they left the factory, while further raising the bar for mobile storage performance with enhanced performance, flexibility and scalability, helping accelerate the adoption of generative AI capabilities in smartphones."