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Micron launched the world's first 176 layer NAND mobile solution, helping 5G ultra fast experience

Jul 22 2022 2022-07 Semiconductors Micron Technology Inc.
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Micron Technology Inc. announced that it has begun mass shipping the world's first general-purpose flash memory UFS 3.1 mobility solution based on 176-layer NAND technology.

     Micron Technology Inc, a leading provider of memory and storage solutions, announced that the company has begun to ship the world's first universal flash UFS 3.1 mobile solution based on 176 layer NAND technology in bulk. This product is tailored for high-end flagship mobile phones. Compared with the previous generation, it can achieve up to 75% improvement in sequential write and random read performance, thus unlocking the 5G potential - it only takes 9.6 seconds to download a 2-hour 4K movie.


     The compact size of Micron 176 layer NAND perfectly meets the requirements of large capacity and small volume of mobile devices. Previously, Micron announced in June that it had shipped PCIe 4.0 SSDs with 176 layers of NAND, providing professional workstations and ultra-thin notebooks with flexible design options of high performance and low power consumption. Today, Micron has successfully applied the cutting-edge NAND technology and performance that pioneered in the entrepreneurial world to smart phones, bringing a faster mobile phone response experience and realizing real multitasking between applications.

 

     Raj Talluri, Senior Vice President and General Manager of Mobile Products Business Unit of Micron, said: "5G communication technology can improve the transmission rate of mobile devices to several gigabytes, but this ultra fast mobile experience must have a high-performance hardware foundation. Micron's 176 layer NAND has achieved technological breakthrough, providing unmatched performance for smartphones, enabling consumers to easily and quickly experience rich multimedia content on the mobile end."


     The mixed workload performance of Meguiar 176 layer UFS 3.1 solution is 15% higher than that of the previous generation, which makes the mobile phone start and switch applications faster, thus creating a more smooth mobile experience. Micron applied layer 176 NAND technology to UFS 3.1 to overcome the storage bottleneck and enable mobile phone users to enjoy 5G high-speed communication.


     Fang Fei, president of the product line of Glory Terminal Co., Ltd., said, "Glory's all-around flagship Magic3 series will be the first to carry the industry's first 176 layer NAND technology UFS 3.1 launched by Micron. This high-performance 3D NAND solution will bring a fast and smooth experience for Glory mobile phone users to use multiple applications at the same time, as well as high-speed unloading, storage and other scenarios."

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