Molex cable assemblies have 40% more contact points than competing products, resulting in high reliability and high performance

     Molex's PowerPlane Open Compute Project (OCP) Open Rack Version (ORV3) cable assembly is a power interconnect device that enables users to develop data center applications using a proven standard architecture. Molex has also created these connector and cable assembly solutions based on the OCP standard to achieve reliable technical performance.

     These power solutions have been thoroughly tested and proven to meet the needs of electronic products from all industries. Molex's PowerPlane OCP ORV3 cable assemblies are designed to overcome customers' architectural challenges, such as misalignments, to maximize operational efficiency. Multiple independent contact points, contact points 40% more than competing products, thus achieving high reliability and high performance.

     Molex's PowerPlane ORV3 cable assemblies are OCP-compliant and meet the need for a more efficient and flexible data center distribution architecture, thereby providing a reliable interconnection solution for hardware applications. Welding terminals provide a highly reliable method of wire terminating, allow flexibility in terminating different wire harnesses, and provide low voltage drop to achieve excellent electrical performance. The ±3.00 mm float in both vertical and horizontal directions provides ample aggregability to compensate for misalignment. These parts match the 3.00mm and 3.18mm thick busbars.