Molex expands its innovative product line of NearStack high-speed cable solutions

     Telecommunications and data center enterprises face increasing bandwidth demands and therefore require high-density interconnections. To meet these needs, Molex continues to develop a variety of innovative connectivity solutions. One of these solutions is the NearStack High-speed Cable Assembly Solution.

     High-speed, high-density applications are abandoning traditional board designs to allow for lower-cost, high-speed alternatives. The NearStack solution optimizes signal integrity channel performance by using direct connection, circuit board bypass and lower loss materials. In addition, the NearStack solution removes heavy timers and other active components from high-speed channels and reduces the number of high-speed layers that need to be routed in expensive printed circuit board materials, reducing costs.

     Liz Hardin, Product Manager at Molex, said: "As the requirements of the system continue to expand, the length of the signal channel increases, and the associated operations become more challenging - the solutions that exist in the field of standard printed circuit boards can pose challenges for clear signal transmission, and the cost can be too high. To address these challenges, Molass is excited to launch the NearStack solution. With the addition of the NearStack 85 Ohm solution to the NearStack portfolio, we look forward to addressing the next generation of system challenges."

     The NearStack 100 ohm product is ideal for applications requiring 100 ohm impedance and is designed in a small package, supports 56 Gbps PAM-4, and is compatible with Molex's BiPass I/O. The solution uses 34 AWG dual coaxial cable to enable high speed crimp jumper products in sizes of 8 differential pairs and 16 differential pairs.

     In addition to the NearStack 100 ohms solution, Moltex also introduced the NearStack 85 ohms solution. Adjusting the design of the NearStack to a normal impedance of 85 ohm gives enterprises another high-speed solution that supports applications that require this impedance, such as PCI-based systems. The NearStack 85 Ohm solution uses a 30 AWG dual coaxial cable for longer transmission distances. The NearStack connector is also compatible with Molex's backplane cable assembly.

     Molex's complete range of data center solutions aim for high scalability, high-speed support, optimized signal integrity, shielding against electromagnetic interference and high thermal efficiency. By working closely with industry-leading technology companies, Molex is focused on supporting customer applications that meet and exceed the 112 Gbps speed requirements, as well as planning for the next generation.