NXP introduces Generation 2 RF multi-chip modules that increase frequency, power and efficiency

NXP Semiconductors announced the launch of the 2nd generation Airfast RF Power Multi-chip Module (MCM), which is designed to meet the evolving requirements of 5G mMIMO active antenna systems for cellular base stations. With a focus on accelerating 5G network coverage, the new family of all-in-one power amplifier modules is based on NXP's latest LDMOS technology, offering higher output power, wider frequency range and increased efficiency in the same form factor as NXP's previous generation MCM products.

The new AFSC5G26E38 Airfast module is a good example of delivering higher performance in the 2nd generation MCM family. The device's output power is increased by 20% compared to the previous generation, meeting the need to provide more 5G coverage per base station tower without increasing the size of the radio unit. It also offers 45 percent power increase efficiency, four points higher than the previous generation, thereby reducing the overall power consumption of 5G networks. The new AFSC5G40E38 leverages the performance of NXP's latest generation LDMOS technology at high frequencies, capable of operating in 5G C bands from 3.7 to 4.0 GHz, and was recently selected for adoption by Rakuten Mobile in Japan.

Paul Hart, executive vice president and general manager of NXP's RF Power Business unit, said: "NXP's new multi-chip modules deliver significant efficiency improvements, thanks to the latest enhancements to LDMOS, as well as improved integration. We strive to improve integration by integrating more features into each module, which means customers have to source, assemble and test fewer components. As a result, our products are able to deliver higher power with a more cost-effective and compact design. This will speed up time to market for customers and network mobile operators to help them meet the demand for 5G expansion."

Comprehensive multi-chip module portfolio for 5G expansion

NXP's RF power multi-chip modules include an LDMOS IC with an integrated Doherty splitter and a circuit breaker for 50 ohm input/output matching. This high level of integration eliminates RF complexity, avoids multiple prototyping, and reduces the number of components to help increase production and reduce certification cycle times. The second generation completes the original series released last year with increased frequency and power levels. Both generations have the same pin output format, allowing RF designers to quickly upgrade from one design to another, reducing overall development time.

Airfast MCM 2 includes 10 new devices covering 5G bands from 2.3 to 4.0 GHz with an average output power of 37 to 39 dBm. These devices are now certified and will be supported by NXP's new RF Power Reference Circuit digital database RF Circuit set.

NXP 5G Access Edge technology portfolio

From antennas to processors, NXP offers a robust portfolio of technology products to support 5G access edge technologies, delivering best-in-class performance and security for infrastructure, industrial and automotive applications. These include NXP's Airfast family of RF power solutions and Layerscape family of programmable baseband processors for wireless data links, fixed wireless access and small base station devices.