NXP introduces the all-in-one 5G mMIMO RF Power amplifier module

     NXP Semiconductors announced the full availability of its full range of RF Power multi-chip modules (MCM) portfolio to support the development of massive MIMO active antenna systems for 5G base stations. NXP's 5G Airfast solution is more integrated, reducing power amplifier size, shortening design cycles and simplifying manufacturing processes.

     Paul Hart, senior vice president and general manager of NXP Radio Power Solutions, said: "5G infrastructure networks are being deployed faster than the previous generation. Our 5G Massive MIMO solution offers a common package of frequencies and power, helping customers and mobile network operators reduce time to market."

     The NXP RF Power Multi-chip module is a 50-ω input/output, two-stage device with integrated Doherty that helps eliminate RF complexity, avoid multiple prototyping, and increase design predictability. Its pin compatibility enables design reuse. Reducing the number of components avoids redundant testing while increasing production and shortening certification cycles.

     The printed circuit board size of the NXP integrated solution is reduced by five times compared to traditional RF designs, helping to meet the size and weight challenges of advanced mMIMO, such as the 64T64R, which requires 64 power amplifiers per antenna.