NXP Semiconductor announced that the global mobile technology company OnePlus has selected NXP's QFN radio frequency front-end solution for Wi-Fi 6 to equip its latest high-end flagship smartphone OnePlus 9 with Wi-Fi 6 functions..NXP's highly integrated QFN radio frequency front-end solution for Wi-Fi 6/6E, which supports the latest Wi-Fi 6 wireless network standard and a new 6GHz spectrum.
The new OnePlus 9 is the first smartphone in the industry to adopt the Wi-Fi 6 QFN solution. This solution can minimize the occupation space of the device within the smartphone. Wi-Fi 6 has a higher data rate and larger capacity. It can create a new experience for smartphone users, and promote new application development with super stickiness in the broad market and service field.
Gu Jiangbo, Director of the RF department of OnePlus mobile phone, said: "Enshi provides a mature small QFN solution that allows us to speed up the time of the product and enable our OnePlus 9 series flagship smartphone to support the new Wi-Fi 6 technology ","
Doeco Terpstra, Vice President of NXP and the smart antenna solution of the Intelligent antenna solution of the Radio Power Business Department, said: "Today, this exciting milestone incident, let us believe that consumers can soon benefit from using exciting new new new ones Wi-Fi 6 technology. "
NXP's QFN radio frequency front-end module details for Wi-Fi 6/6E: New NXP WLAN7205C single-channel QFN solution provides single-chip small packaging, integrates power amplifiers, switches and low noise amplifiers to improve the Wi-Fi of the mobile phone. The scope of communication. Unlike the existing dual -channel module solutions in the market, QFN packaging can be placed near an antenna to reduce wiring loss. This can improve the efficiency of sending and receiving, increasing battery life, thereby extending the use time of Wi-Fi, speeding up data transmission speed, and ultimately improve the user experience. The WLAN7205C solution integrates a power amplifier, switch and low noise amplifier in a single chip to achieve the smallest QFN packaging.
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