NXP supplied Murata with RF front-end ics for Wi-Fi 6 modules

     NXP Semiconductors has announced a partnership with Murata, a manufacturer of system-level packaging integrators for 5G mobile platforms, to be the first to deliver radio frequency (RF) front-end modules for the new Wi-Fi 6 standard. The two companies will work together to deliver solutions for next-generation Wi-Fi 6 implementations that reduce design time, shorten time to market and save board space. The NXP FEIC uses a compact chip-level package (CSP) for module integration to support a wide range of 5G smartphones and portable computing devices. In addition, it ensures high performance 2x2 Multiple input Multiple Output (MIMO) capabilities.

     Katsuhiko Fujikawa, Research and Development Manager at Murata, said: "Murata is very willing to work with NXP to develop RF front-end modules for the Wi-Fi 6 platform, as NXP's single-chip front-end ics are already fully certified in the leading-edge Wi-Fi 6 platform and are flexible and reliable in terms of size and integration. We plan to continue our deep collaboration with NXP and hope to develop a new generation of modules to support new spectrum and standards in the coming years."

     Paul Hart, senior vice president and general manager of NXP's RF Business group, said: "Partnering with Murata Manufacturing helps manufacturers deliver highly integrated, well-tested and qualified solutions for 5G devices, while meeting the rapidly growing global demand for Wi-Fi 6 with outstanding performance and small size. No other chipmaker in the industry has yet come up with a better solution to meet the rapid deployment needs."