New BiPass thermal management configuration cooling module QSFP-DD

     Molex introduces the new BiPass Thermal Management Configuration cooling module QSFP-DD, which can handle up to 20 watts of power and reduce ambient temperatures by 15 degrees Celsius. Molex's QSFP-DD thermal solutions can be cooled in a wide range of configurations for power from 15 watts to 20 watts. The BiPass solution allows for the cooling of higher wattage modules, assisting designers towards speeds of 112 Gbps.

     With the next generation of copper and optical cable QSFP-DD transceivers ready for release, thermal management strategies are playing a crucial role. Molex demonstrated the QSFP-DD front-to-front BiPass configuration, the QSFP-DD front-to-front SMT configuration, the QSFP-DD stack configuration for 2x1, and the QSFP-DD BiPass configuration for 1x2 vertically with dual heat sink. All configurations operate at 15 watts of power and can be cooled at any temperature change below 25 degrees Celsius.

     The BiPass solution can send high-speed signals over the Temp-Flex dual coaxial cable path, allowing for a greater channel margin than using a printed circuit board alone and allowing a second heat sink to be placed on the bottom side of the cage to make contact with the module, providing further cooling.

     Chris Kapuscinski, Global Product Manager at Molex, said: "If you need to cool a 15-watt module, there are a lot of different solutions available today. We are now able to cool modules with higher wattage. The BiPass solution offers significant cost savings for designers and is an important factor in advancing the implementation of 112 Gbps PAM-4."

     The BiPass solution enables designers to leverage Temp-Flex high-speed dual-coaxial cables without the need for lossy printed circuit boards. In this way, they can reduce insertion losses when routing from an ASIC or router in the switch to another server in the rack. Advances in heat sink technology are enabling efficient, reliable and resilient thermal management strategies that can support higher densities in both copper and optical cable connections. From a future perspective, this excellent signal integrity performance and low insertion loss feature could enable designers to universally adopt passive copper cables throughout their designs.

     Kapuscinski added, "As the demand for faster data rates continues to climb, data center technology is advancing at a rapid pace, and thermal management technology must move alongside it. "The BiPass solution uses advanced materials, the latest tools and state-of-the-art technology to provide better temperature control for the system without compromising performance."