New MicroTPA 2.00mm wire-to-board and wire-to-wire connector system

     Molex announces MicroTPA 2.00mm wire-to-board and wire-to-wire connector systems that provide electrical and mechanical reliability in a high-temperature design to meet the requirements of a wide range of industries. The connectors are ideal for consumer and automotive markets that require compact wire-to-board and wire-to-wire connector systems with current ratings up to 2.5 amps for use in confined Spaces.

     MicroTPA 2.00mm wire-to-board and wire-to-wire connector system has many advantages, online wire-to-wire connector system can be provided with 2 to 15 circuits, accept a wide range of wire specifications, the use of wire terminals are already popular products in the market, with TPA support ring, locking structure, It is RoHS compliant, can withstand high temperatures well, and has a vertical through hole joint with a pitch of 2.00 mm.

     Mariko Okamoto, global Product Manager at Molex, said: "The new MicroTPA connector system is designed to withstand harsh environmental conditions. For example, the bottom and ledges of the connectors have been raised so that the potting material covers the entire printed circuit board, preventing moisture from entering the connectors and avoiding some common problems with electrical conductivity."

     Compared to similar connector systems on the market today, the MicroTPA 2.00mm wire-to-board and wire-to-wire connector systems deliver 2.5 amps of current with a temperature range of -40 to +105˚C and a cable range of 0.85 mm to 1.50 mm.