Nexperia Releases Ultra Small DFN MOSFET

     Nexperia, a high-capacity production expert in the field of basic semiconductor devices, announced the launch of a new series of 20 V and 30 V MOSFET DFN0603 using ultra small DFN packages. Nexperia has previously provided ESD protection devices with this packaging. Now, Nexperia has made further progress by successfully applying this packaging technology to the MOSFET product portfolio, becoming a leader in the industry competition

     The new generation of wearable devices and audible devices are integrating new artificial intelligence (AI) and machine learning (ML) technologies, which brings several challenges to product design. First of all, with the increase of functions, the available circuit board space becomes very valuable. In addition, with the increase of power consumption, heat dissipation has become a problem that cannot be ignored.

     Nexperia, as a leader in the discrete device production industry, has successfully overcome these two problems by virtue of decades of experience in designing this ultra small size innovative MOSFET series. The ultra-thin DFN0603 package is only 0.63 x 0.33 x 0.25 mm, which uses 13% less space than the MOSFET of the second small package (DFN0604). It is amazing that this reduction in size has no impact on device performance. In fact, the RDS (on) of these MOSFETs has been reduced by 74%, which helps to improve efficiency, so that wearable device design can achieve greater power density.