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Nexperia expands discrete device products with small DFN packages and wettable side pads

Sep 16 2022 2022-09 Power Nexperia
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Nexperia, a high-throughput manufacturing specialist in basic semiconductor components, announced the launch of its discrete component series, which consists of pin free DFN packages complete with wet-side pads (SWFS). These devices are robust and space-saving, helping to meet the needs of next-generation smart electric vehicle applications

     Nexperia announced the launch of a new product in its split device family, which is packaged in a leadless DFN package and equipped with a side wettable pad (SWF). These devices are durable and space saving, which will help to meet the application needs of the next generation of intelligent electric vehicles. All Nexperia product lines are AEC-Q101 compliant, including:BC817QBH-Q and BC807QBH-Q series 45V 500mA NPN/NPN universal triodes packaged with DFN1110D-3 are used. BAT32LS-Q and BAT42LS-Q general schottky diodes packaged with DFN1006BD-2. PDTA143/114/124/144EQB-Q series 50V 100mA PNP resistor distribution triode (RET) product series packaged with DFN1106BD-2 and DFN1110D-3 and BAS21LS-Q high-speed switching diode. 2N7002KQB (60V, N-channel Trench MOSFET) and BSS84AKQB (50V, P-channel Trench MOSFET) packaged by DFN1110D-3

 

     Nowadays, the number of electronic components used in new cars is increasing, and the demand for circuit board space is increasing. Compared with SOT23 package, leadless DFN package can save 90% of the space, helping to reduce the space demand for circuit boards. The side wettable pad can perform reliable automatic optical inspection (AOI) on the quality of solder joints. The DFN package of Nexperia has excellent heat dissipation performance and high Ptot value. It is the strongest product among the products that have passed the industry's life extension and reliability tests.

 

     Mark Roeloffzen, Senior Vice President and General Manager of Nexperia Bipolar Discrete Devices Business Department, said: "Nexperia took the lead in developing DFN packages with wettable pads on the side. Now it can provide a series of small pin less packaged discrete devices that meet the AEC-Q101 standard. At present, more than 460 different large batches of devices have been sealed with the recently released DFN1412D-3, DFN1110D-3 and DFN1006BD-2. Nexperia has introduced more devices with small packages to provide more opportunities for design engineers to help them create future oriented designs, Play a role in future mobile applications. With the adoption and investment of major first tier suppliers in the automotive industry in the design, this new technology has been successful. "

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