Nexperia introduces a half-bridge automotive MOSFET with space-saving LFPAK56D package technology

     Nexperia has announced a range of half-bridge (high-end and low-end) automotive MOSFETs featuring space-saving LFPAK56D package technology. A half-bridge configuration with two MOSFETs is a standard building block for many automotive applications, including motor drivers and DC/DC converters. This new package provides a single-device half-bridge solution. Compared to two-channel MOSFETs for three-phase motor control topologies, they take up 30% less PCB area due to the removal of PCB lines, while enabling simple automated optical inspection (AOI) in the production process.

     The LFPAK56D half-bridge product uses the existing high-volume LFPAK56D packaging process and has mature automotive grade reliability. This form of package uses flexible pins to improve overall reliability, and the internal copper clip connection between MOSFETs simplifies PCB design and leads to a plug-and-play solution with a current handling capacity of 98A, which performs very well. Typically, in a half-bridge structure, the PCB connection between the source of the high-side MOSFETs and the drain of the low-side MOSFETs generates a large amount of parasitic inductance. However, with an internal clip-on connection, the LFPAK56D half-bridge package successfully reduces parasitic inductance by 60%.

     The newly introduced LFPAK56D half-bridge MOSFETs are BUK7V4R2-40H and BUK9V13-40H. Both products feature the highly durable Trench 9 automotive grade wafer process technology, rated at 40 V, and have been validated in critical tests to double the automotive AEC-Q101 specification. The RDS(on) of these two devices are 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13).

     The AEC-Q101-compliant Nexperia LFPAK56D half-bridge package is suitable for a wide range of three-phase automotive powertrain applications, such as fuel pumps, water pumps, motor control and DC/DC power conversion. It takes up 30% less PCB area and 60% less parasitic inductance, making it suitable for high-performance switching applications. With design adoption and input from key automotive customers, this new technology is already a success.