Nexperia introduces the first LED driver with solderable sides in the DFN package

     Nexperia, a high-capacity production specialist in the production of basic semiconductor components, has announced a new range of LED drivers in a DFN2020D-6 (SOT1118D) package that saves space. The LED driver has a solderability side (SWF) that facilitates AOI (Automatic Optical Inspection) and improves reliability. This is the first time LED drivers have used this beneficial package. The new pin-free products join the already mass-produced pin-free products to provide a broader product portfolio, and the new products reduce PCB space by 90% compared to the SOT223 with the same performance.

     The newly launched DFN2020D-6 LED driver uses NPN and PNP technologies and has a pin size of only 2x2 mm and an external size of 0.65 mm. The device has an output current of 250 mA (NCR32x model) and a maximum supply voltage of 75 V. Their high thermal power performance is no less than that of LED drivers with other packages. The device not only enables AOI, which is critical for automotive customers, but also improves reliability. Compared with devices without solderable sides, devices with solderable sides are more resistant to shear forces, more flexible, and less likely to break.

     Frank Matschullat, Nexperia Product Group Manager, commented: "The new device with SWF and in the DFN2020D package solves the problems of size, performance and robustness. The device is ideal for general lighting, white goods and automotive. Nexperia is committed to offering a wide portfolio of discrete devices with DFN technology, so it's only natural for LED drivers to come in this rugged, space-saving package. Of course, the device will also be in a pin-SMD package, so customers can choose according to their needs."