Nexperia introduces the new Trench Schottky rectifier with rated voltage and high current

     Nexperia, A specialist in basic semiconductor devices, has announced the expansion of its Trench Schottky rectifier portfolio with new devices rated up to 100 V and 20 A, respectively, for excellent switching performance and leading thermal performance. The new device is available in Nexperia's clip-on FlatPower (CFP) package with a much smaller pin size than SMA/SMB/SMC devices.

    The Trench process significantly reduces the Qrr charge stored in the device while reducing the leakage current. As a result, the Trench Schottky rectifier is able to achieve ultra-fast switching speeds, both to reduce the switching loss of the rectifier, and to reduce the loss of MOSFETs in the same commutating unit (this configuration is commonly used for asynchronous switching mode power converters). Nexperia's PMEGxxxTx devices also offer a wide safe working area (SOA) with a greater safety margin and reduced risk of thermal runaway compared to commercially available devices today.

     Jan Fischer, Nexperia Product Manager, notes, "Nexperia's Trench Schottky rectifier combines the benefits of forward voltage reduction with extremely low Qrr, enabling optimal efficiency while delivering the high switching speeds required for switch-mode power converters. A wide range of automotive applications, including LED lighting, will benefit from the wide safe working area our devices provide."

     Nexperia is increasing its investment in the Trench Schottky rectifier portfolio, which now has 31 devices in series production, ranging from 40 V to 100 V and up to 15 A ratings. An additional 17 devices, including several 20A devices, are undergoing sample evaluation. The PMEGxxxTx device is available in a clip-on FlatPower package (CFP3/5/15(B)). This type of package is space-saving and thermally efficient, and has become the industry standard for power diodes. The clip-on FlatPower package features solid copper clips that reduce thermal resistance and better transfer heat to the surrounding environment, making the PCB smaller and more compact.