Nexperia launches in a small, pin-less durable DFN package

     Nexperia, a high-throughput production specialist in the production of semiconductor foundation components, announced the industry's broadest AEC-Q101-compliant discrete semiconductor portfolio for automotive applications in DFN (Discrete Flat pin-free) packages with high thermal efficiency, space savings, and AOI inspection compatibility. Covers Nexperia's entire product portfolio, including switches, Schottky, Zener and protection diodes, bipolar junction transistors (BJTS), n-channel and P-channel MOSFETs, resistance transistors and LED drivers.

     Nexperia offers a variety of automotive grade discrete device pin-free packages, from the small size DFN1006BD-2 (1 x 0.6 x 0.5 mm) to DFN2020D-3 (2 x 2 x 0.65 mm), including the recently announced DFN1110D-3 and DFN1412D-3. The DFN device can be as small as 0.6 mm2, saving 90% PCB space compared to existing SOT23 devices. With excellent thermal performance (RTHJ-S), not only does it provide equal or even better thermal power in a smaller DFN space, but these packages dissipate better heat and the overall system performance is more reliable. The Nexperia DFN package technology supports TJ up to 175°C.

     AOI is critical for certain applications, particularly in the automotive sector, so Nexperia pioneered the DFN package with a solderable side (SWF) in 2010, and devices with SWF packages are now recognized as a mature solution. With SWF, visible solder joints can be checked after welding. An additional benefit of DFN packages with SWF is the ability to achieve higher mechanical strength with PCB connections compared to devices without SWF. SWF can increase the shear force and improve the bending resistance of the board.

     Mark Roeloffzen, vice president and general manager of Nexperia's Bipolar Discrete Devices business group, said: "Nexperia's automotive DFN package family gives engineers more choice: develop applications in existing pin-based SMD packages or in space-saving DFN packages. We are committed to leading the market through package innovation, offering a diverse portfolio of discrete devices in DFN packages to meet customer needs."

     Discrete semiconductors in DFN packages are now in volume production, and Nexperia will unleash additional capacity in 2020 to provide the industry with a comprehensive discrete device portfolio. Existing types include standard high power products such as the BC847, BC817 and BAV99, among others.