Nexperia, a specialist in high-capacity production of basic semiconductor devices, announced that it now offers a portfolio of 22 new planar Schottky diodes in the CFP3-HP package. The portfolio includes 11 industrial products as well as 11 AEC-Q101 compliant products. This product release supports the growing trend of manufacturers replacing SMX-type packages with smaller CFP packages, especially in automotive applications. These diodes are suitable for DC-DC conversion, continuous current, reverse polarity protection, and OR-ing(burping) applications.
To maximize design flexibility, the device options in this portfolio offer reverse voltage VR(max) from 30 V to 100 V and forward current IF(average) from 1 A to 3 A. A key feature of the CFP3-HP is the use of an exposed heat sink, thus providing an extremely high level of heat dissipation efficiency (Ptot) at this package size (3.7mm x 1.8mm x 0.9mm).
Frank Matschullat, product line manager for power bipolar discrete devices at Nexperia, said: "As the industry packaging trend shifts to smaller packages such as CFPS, Nexperia is committed to actively driving this trend and accelerating our commitment to package innovation. By investing heavily in capacity expansion, we are well positioned to meet the growing demand for CFP packaging products and exceed total market expectations for the next three years. These diodes mark a new expansion of our extensive portfolio of more than 270 CFP packages."
These packages utilize a proprietary copper clip design to meet challenging efficiency and space saving design requirements. Today, CFP packages are available for different power diode technologies, such as Nexperia's Schottky rectifier diode and fast recovery rectifier diode, but can also be extended to bipolar trisomic tubes. This adds significant product diversity and further strengthens Nexperia's position as a leader in packaging innovation. A broader selection of devices can be offered to customers through semiconductor manufacturers with trusted supply chains.
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