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Nexperia's 50µA Zener diode products extend battery life and save PCB space

Jun 6 2023 2023-06 Power Nexperia
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Nexperia has announced a full line of low current voltage regulators. The 50µA Zener diode family is available in three different SMD package options in an ultra-small discrete flat pin-less (DFN) package and AEC-Q101 compliant device, giving customers more choice and flexibility.

     Nexperia, a specialist in high-capacity production of basic semiconductor components, introduces a full range of low-current voltage regulators. The 50µA Zener diode family is available in three different SMD package options in an ultra-small discrete flat pin-less (DFN) package and AEC-Q101 compliant device, giving customers more choice and flexibility. These high-efficiency diodes operate with performance at low test currents (50μA), making them ideal for low bias current and portable battery-powered devices in mobile, wearable, automotive and industrial applications.

 

     Paula Stumer, Nexperia product manager, said: "The DFN1006BD-2 package with wet-tin weldable Side wet-tin Pad (SWF) addresses size, performance and tolerability for a wide range of applications, and we offer a wide portfolio of 50μA Zener diodes with DFN technology that supports a wide voltage range from 1.8V to 75V. These devices are also available in pin-SMD packages, giving customers flexibility."

 

     With 40 new types of each package option and a nominal operating voltage range of 1.8V to 75V, the series is available in ultra-thin table mount packages of SOT23 (BZX8450), SOD323 (BZX38450) and SOD523 (BZX58550). And pin-free DFN1006BD-2 (BZX8850S) package. Zener diode non-repetitive reverse peak power consumption ≤40 W, total power consumption ≤300 mW, low dynamic resistance.

 

     Zener diodes can also be used to supply Q portfolio devices that comply with AEC-Q101 and ISO/TS16949 automotive quality standards. A growing number of non-automotive applications require additional quality-related services, such as PPAP (production part approval process) and longer delivery schedules, and these Q portfolio devices can meet these needs.

 

     The DFN compact package size (1.0 mm x 0.6 mm x 0.47 mm) is suitable for replacing the large-size pin package on the PCB, saving up to 60% space. The device is equipped with wettable solder side wettable solder pads (SWF) to ensure solder flows along the side of the chip when soldering on the PCB. The technology supports automated optical inspection (AOI) to ensure the high safety and reliability quality requirements of the automotive industry are met. The DFN package Zener diode has a higher P(tot) value and a lower operating temperature than a pin device, thus improving system reliability.

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