Nexperia's smallest SD card level converter reduces the pin size by 40%

     Nexperia, a high-capacity production expert in the field of basic semiconductor components, announced the launch of the world's smallest secure digital (SD) card level converter IC - NXS0506UP. This bidirectional dual voltage level converter, which meets the requirements of SD 3.0 standard, is packaged in a wafer level chip size with 16 bumps. The pin size is 1.45mm x 1.45mm x 0.45mm, and the spacing is 0.35mm. The size is 40% smaller than that of the device with 20 bumps.

     NXS0506UP integrates automatic direction control, EMI filter characteristics and IEC 61000-4-2 ESD protection characteristics. The device can operate at a clock frequency of up to 208 MHz and a data rate of up to 104 Mbps.

     Vikram Singh Parihar, senior product manager of Nexperia, said: "Although NXS0506 was previously dedicated to consumer devices such as smartphones, laptops, game consoles, cameras, and wireless access points, we have also seen it used in home medical devices and automotive systems. NXS0506 is the industry's smallest SD 3.0 card level converter, which can support the ultra-high speed SDR104 mode and help consumers experience the faster data rate provided by the SD 3.0 memory card solution."

     The new NXS0506UP SD card level converter has built-in pull-up and pull-down resistors to reduce BOM cost. Because DATA channel and CMD channel can be used interchangeably without affecting functions, the device can be directly connected to the latest host CPU/SOC ASIC, which is easy to use.

     Vikram added: "Nexperia is able to reduce the size of these new converters thanks to the adoption of new process nodes and innovative wafer level chip size packaging (WLCSP).