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ON launched three car power modules based on silicon carbide for car charger

Nov 3 2022 2022-11 Semiconductors ON Semiconductor
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     ON announced the launch of three power modules based on silicon carbide (hereinafter referred to as "SiC"), which use die-casting die technology for on-board charging and high-voltage (hereinafter referred to as "HV") DCDC conversion of all types of electric vehicles (hereinafter referred to as "xEV"). APM32 series is the first product in the industry to combine SiC technology with die casting die packaging, which can improve energy efficiency and shorten the charging time of xEV, and is dedicated to high-power vehicle chargers from 11 kW to 22 kW (hereinafter referred to as "OBC").

 

     These three modules all show the advantages of low conduction loss and switching loss. Combined with the best thermal resistance and high voltage isolation in the same class, they can handle 800 V bus voltage. Higher energy efficiency and less heat eventually make OBC more powerful. It enables the xEV to charge faster and have a longer range, which are two key factors that consumers attach great importance to.

 

     Fabio Necco, Vice President and General Manager of ON Automotive Power Solutions, said, "Our new module uses the latest SiC technology to minimize the loss and overall system volume, which supports designers to achieve the goal of improving charging efficiency and saving space. Designers can configure their designs faster by using the pre configured module format, greatly shortening the time to market and reducing design risks."

 

     With ON's end-to-end SiC supply chain capabilities and proven SiC MOSFETs and diodes, the APM32 module has high reliability, and each module is serialized and fully traceable. These modules can operate at junction temperatures (Tj) up to 175 ℃, ensuring reliability even in challenging, space constrained automotive applications.

 

     Simon Keeton, Executive Vice President and General Manager of ON Power Solutions, said: "APM32 provides customers with differentiated solutions. It uses the best packaging of the same kind from Anson, giving full play to cutting-edge SiC technology capabilities. In addition, we know that customers attach importance to supply assurance, and our end-to-end SiC supply chain capabilities can provide such assurance."

 

     The two modules NVXK2TR40WXT and NVXK2TR80WDT of the APM32 series adopt the H-bridge topology, and the breakdown (V (BR) DSS) voltage is 1200 V, thus ensuring that they are suitable for high-voltage battery packs. They are designed for OBC and HV DCDC conversion sections. The third module, NVXK2KR80WDT, adopts the Vienna rectifier topology for the power factor correction (PFC) section of OBC. The 6-pack module and the full bridge module will also be introduced soon to improve the SiC OBC product portfolio.

 

     The three modules all adopt compact, strong dual in-line package (DIP), which ensures the low impedance of the module. The top water cooling and isolation functions meet the most stringent automotive industry standards. Creepage distance and electrical clearance shall comply with IEC 60,664-1 and IEC 60,950-1. In addition, these modules also comply with AEC-Q101 and AQG 324 vehicle regulations.

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