OmniVision Technologies Launch of in-vehicle SoC solutions for round-view and rear-view cameras

     OmniVision has announced the OX01F10, a 1.3 megapixel SoC solution that provides automotive developers with the industry's best image quality in a wide variety of challenging lighting environments, while achieving smaller camera module size and power consumption. In a 1/4-inch optical package, the OX01F10 integrates a 3.0 micron image sensor and an advanced ISP to help design single-board (PCB) vehicle rear-view camera (RVC) and round-view camera (SVS) solutions. Achieve smaller packages, superior low-light performance, lower power consumption, cost savings, and improved reliability.

     Analysts predict that SVS and RVC will continue to dominate the in-car camera market, and will also exceed 50% of the total market size by 2023. SVS growth, in particular, is expected to double between now and 2023 due to increased loading rates. Our OX01F10 provides automotive developers with a better option to respond to the continued growth and improvement of RVC, as well as the gradual expansion of SVS into mainstream models. In addition, the functional safety features of the SoC allow module manufacturers to design and produce a single module for both visual applications and machine vision applications that require ASIL B capabilities.

     OmniVision's Dual conversion Gain (DCG) technology is also used on the SoC, achieving a 120dB dynamic range with two exposures instead of the three used by competitors, thus minimizing motion drag while reducing power consumption and improving low-light performance. Its integrated ISP further provides the following advanced features for better image quality: lens aberration correction

     The PureCel Plus technology is known for its low illumination sensitivity, offering an industry-best 0.19 Lux SNR1. This technology enables the OX01F10 to outperform its competitors in a variety of challenging lighting conditions, including eliminating unnatural LED halos and providing better contrast in bright daylight conditions. OX1F10 only Typical power consumption of 300mW, 30% lower than the competition, can effectively reduce the camera temperature.

     In fact, this is the first solution in the industry that can eliminate the need for metal housing and allow the use of plastic housing to reduce costs. Based on its smaller package size, it also makes it possible to have smaller cameras to accommodate a variety of tighter space requirements. And, thanks to the integration of image sensors and ISPs in one chip, designers can also save on cost and space, eliminating the need for traditional dual-board schemes.The SoC offers a resolution of 1.3 megapixels, and a pixel size of 1340 × 1020 can achieve a frame rate of 30fps, fully meeting the needs of optical center calibration. It can also be flexibly output via 2-lane MIP or 10-bit DVP interface.