PI introduces new PrimePACK 3+ Plug-and-play gate drivers

     PI introduces a new plug and play gate driver that can be used with Infineon's PrimePACK™3+ and similar IGBT modules from Fujifilm for two - and three-level applications. The SCALE-2™ 2SP0430T2XX gate driver board is suitable for industrial, traction, UPS and renewable energy applications and provides reinforced insulation for 1200 V and 1700 V IGBT modules.

     The 2SP0430T2XX product family integrates a number of safety features such as undervoltage protection (UVLO), short circuit protection and the new Dynamic Advanced Active Clamp (DAAC) to meet the IEC60664-1 and IEC61800-5-1 standards, and is available in PD2 and PD3 support versions. DAAC is particularly suited to provide protection for photovoltaic inverters (PV) and traction drive applications, where unstable supply voltages can cause DC bus voltages to rise to their maximum.

     The 2SP0430T2XX gate driver is available in two different versions for 1200 V and 1700 V PrimePACK 3+ IGBT modules to support systems with an insulation class of 5000 VAC (50 Hz/1min) and 9150 VAC (50 Hz/1min), respectively. All models are coated with tri-resistant paint to enhance the durability of the plug-and-play drive board in harsh environments. The peak output gate current is ±30 A, the gate voltage regulator is +15 V/-10 V, and each channel can provide up to 4 W output power (ambient temperature 85°C). The transmission delay is less than 100 ns, and the jitter varies to ±4 ns.

     Michael Hornkamp, Senior Marketing Director for Gate Drive products at Power Integrations, said: "Our SCALE-2 technology reduces system BOM costs and improves system reliability with all key protection features and DC-DC power in the drive. DAAC ensures the best possible protection against overcurrent and short circuit shutdowns."

     Hornkamp added: "Our new 2SP0430T2xx gate driver is the first of its kind in the industry market because it includes a variant of the 1700 V PrimePACK IGBT module that meets PD3 requirements for creepage distance and electrical gap, and is capable of operating in three-level applications with grounded DC power. This makes the device very easy to use, which reduces development difficulties for engineers and reduces time to market."