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Renesa Electronics Launches Advanced Bluetooth Wireless System on Chip with High Integration and Low Power Consumption

Sep 4 2022 2022-09 Semiconductors Renesas Electronics America
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Renesas Electronics announces the launch of the SmartBond DA1470x Family of low-power Bluetooth ® (LE) solutions -- advanced, integrated System-on-chip (SoC) for wireless connectivity

     Renesa Electronics announced the launch of the SmartBond DA1470x product family low-power Bluetooth (LE) solution - an advanced integrated system on chip (SoC) for wireless connectivity. The DA1470x product family is the only solution in the field of low-power Bluetooth technology that integrates power management unit, hardware voice activity detector (VAD), graphics processing unit (GPU) and low-power Bluetooth connection functions into a single chip. Its diversified functions provide advanced sensor and graphics functions for intelligent IoT devices, as well as seamless, ultra-low power consumption and always online audio processing capabilities. As a result, this new product family has also become an ideal choice for Bluetooth control of wearable devices such as smart watches and fitness trackers, glucose monitor readers and other consumer medical and health care devices, household appliances with display screens, industrial automation and safety systems, and electric bicycles and game devices.

 

     Sean McGrath, Vice President of Connection and Audio Business Department of Renesa's Internet of Things and Infrastructure Business Headquarters, said: "The DA1470x product family has successfully expanded Rexa's multi-functional integration strategy, covering stronger processing power, expanded memory, improved power modules, and VADs for online wake-up and command word detection at any time. This feature rich SoC product family allows developers to break through the boundaries of connected consumption and industrial applications, and enable their IoT products to meet the needs of future applications, while optimizing their IoT products Material cost "

 


     The high level of integration further saves the cost of bill of materials (BOM) and realizes a cost-effective system solution. It also reduces the number of components on the PCB, realizes smaller shape design, and makes room for additional components or larger batteries. Due to the reduction of components on PCB, the system reliability is improved, thus further reducing the total cost of sales (COGS) of terminal products.

 


     The SmartBond DA1470x product family has been widely recognized in the market. For example, DA14706 has become the core device of the newly launched Xiaomi bracelet 7. The bracelet features a compelling 1.62-inch, 192 x 490 resolution AMOLED display that delivers 120 sports modes and a typical 15 day battery life.

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