Renesas Electronics introduces a new Bluetooth Low Energy SoC to bring lower energy consumption to in-car applications

Renesas Electronics has announced the launch of the industry's premier new Bluetooth chip, the DA14533. The chip integrates an RF transceiver, Arm® M0+ microcontroller, memory, peripherals, and security functions in a compact system-on-chip (SoC) design. As the first device in Renesas' Bluetooth Low Energy SoC family to be certified to vehicle specifications, the DA14533 features advanced power management capabilities that simplify system integration and reduce power consumption. With the certified Bluetooth Core Specification 5.3 software stack and extended temperature support, developers can quickly develop projects for diverse applications including tire pressure monitoring, keyless access, wireless sensors and battery management systems.

Optimized design for superior energy efficiency

Building on Renesas' leading position in Bluetooth Low Energy SOCs (SmartBond Tiny family of products) and industry-leading low power technology, the new DA14533 incorporates the industry's most advanced power management capabilities: The integrated DC-DC step-down converter is built in to precisely adjust the output voltage according to system requirements; In the working state, the system power consumption is significantly lower than that of similar products in the market, only 3.1mA in transmission, and 2.5mA in reception; In sleep mode, the current is as low as 500nA. These power management and energy saving features help significantly extend the life of small battery powered systems and easily meet the demanding power requirements of tire pressure monitoring system task configurations.

AEC-Q100 certified with the latest safety features

The DA14533's designation as AEC-Q100 Level 2 compliant means it has been rigorously tested to ensure superior quality and reliability in extreme on-board environments. In addition, the extended temperature range (-40 to +105°C) further guarantees reliable performance under harsh conditions, making it ideal for systems with high requirements for stability and durability in automotive, industrial and other fields. The product complies with Bluetooth Core Specification 5.3 and contains the latest security features to protect connected devices from a variety of threats.

Chandana Pairla, VP of Connectivity Solutions Division at Renesas, said: "Our SmartBond Tiny SoC product family has achieved remarkable success in the industrial market, with more than 100 million units shipped to date. "This new vehicle-scale product will enable a new generation of battery-powered automotive and industrial systems to unlock the next level of Bluetooth low energy applications, fully meeting the stringent requirements of these applications for high energy efficiency, small size and wider temperature adaptability."

Reduce BOM, reduce costs and simplify development

Similar to other Bluetooth low energy SoC devices in the SmartBond Tiny family, the DA14533 requires only six external components, providing a best-in-class engineering bill of Materials (eBOM).

A single external crystal oscillator (XTAL) is used for both work and sleep mode, eliminating the need for a separate oscillator for sleep mode. The ultra-compact design in the WFFCQFN 22-pin 3.5mm x 3.5mm package makes it the smallest car-scale low-power Bluetooth SoC on the market. Thanks to its compact design and simplified eBOM, the product can be seamlessly integrated into space-constrained systems, reducing overall system costs and reducing time to market for customers.