ST unveils new advanced 6-axis IMUs with built-in sensor fusion technology and artificial intelligence

     The LSM6DSV16X's advanced architecture enables complex tasks on edge devices and is ideal for advanced 3D phone depth maps, situational awareness for laptops and tablets, reliable and precise gesture recognition for XR headsets, and alway enabled activity tracking. All processing is done on the MEMS sensor because there are three different cores on the sensor for user interface control and optical/electronic image shake prevention (OIS/EIS).

     The chip integrates an enhanced finite-state machine (FSM) for detecting fast events and custom gestures. In addition, the latest update to Stmicro's innovative machine learning kernel (MLC) improves the performance of reasoning algorithms such as human activity recognition. Stmicroelectronics posted immediately available MLC and FSM algorithms on GitHub to help product designers add these advanced features to new products while reducing time to market. The IMU also outputs AI features extracted by the MLC for external processing.

     The ASC automatically optimizes the sensor's range, frequency, and other Settings in real time without the intervention of the master controller. Combined with stmicroelectronics's Sensor Low Power Fusion (SFLP) technology, ASCs enable IMUs to have fast and powerful edge processing capabilities with very low power requirements. The SFLP allows gesture recognition or continuous tracking while operating with only 15µA.

     In addition, for the first time, the LSM6DSV16X incorporates a Charge Change (ST Qvar®) detection channel in the IMU to detect changes in electrostatic charge via either body-contact electrodes or non-contact induction (" radar ") in the smartwatch or fitness band. The ST MEMS sensor with the ST Qvar® function supports advanced user interface controls such as touch, long press, and slide, ensuring seamless human-computer interaction.

     As a high accuracy 6-axis MEMS IMU, the LSM6DSV16X has a built-in 3-axis low noise accelerometer and a 3-axis gyroscope for excellent measurement accuracy, uses industry standard dimensions and integrates with the new I3C interface. Both structures maintain high stability after reflow soldering, avoiding the need for equipment manufacturers to recalibrate IMUs on the production line and ensuring sensor performance.

     The LSM6DSV16X is available in a 2.5mm x 3.0mm x 0.83mm 14-pin LGA package and is now in mass production with a starting price of $2.98 for 1000 units. Stmicroelectronics will continue to expand its third-generation lineup in the coming months by adding several additional sensors with different capabilities and capabilities.