STMicroelectronics Gauge dual in-line silicon carbide power modules available in multifunctional package configuration

     STMicroelectronics released ACEPACK1 DMT-32 series of gauge Silicon Carbide (SiC) power modules, the new series of products in a convenient 32-pin dual in-line through hole plastic package, The target applications are automotive systems such as vehicle charger (OBC), DC/DC transformer, oil pump, air conditioner, etc. The advantages of the product include high power density, highly compact design and easy assembly, etc. The three package configurations of four-tube full bridge, three-phase six-tube full bridge and totem pole are provided to enhance the system design flexibility.

     The new module has a built-in 1200V SiC power switch tube, and STMicroelectronics 2nd and 3rd generation SiC MOSFET technology ensures that the silicon carbide switch tube has a very low on-resistance RDS(on). The efficient switching performance of the module minimizes the impact of temperature, ensuring high energy efficiency and reliability of the power conversion system.

     Thanks to STMicroelectronics' proven and robust ACEPACK packaging technology, these modules reduce overall system and design development costs while ensuring excellent reliability. The packaging technology uses a high-performance aluminum nitride (AlN) insulated substrate for excellent thermal performance. There is also an NTC temperature sensor in the package that provides temperature monitoring information for the thermal protection mechanism.

     The M1F45M12W2-1LA is the first product in the ACEPACK DMT-32 series, with volume production beginning in the fourth quarter of 2023. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA prototype is now available for mass production starting in the first quarter of 2024. Price depends on product configuration.