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STMicroelectronics has announced a new Bluetooth LE system chip, the BlueNRG-LP

Jan 19 2021 2021-01 Connectors STMicroelectronics
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STMicroelectronics has announced its latest Bluetooth LE system-on-chip (SoC), BlueNRG-LP, which takes full advantage of the latest Bluetooth specifications to extend communication distance, improve throughput, enhance security, and save power.

     STMicroelectronics has announced its latest Bluetooth LE system-on-chip (SoC), BlueNRG-LP, which takes full advantage of the latest Bluetooth specifications to extend communication distance, improve throughput, enhance security, and save power. The optimized ultra-low power RF module operates with only 3.4mA in receive mode, 4.3mA in transmit mode and less than 500nA in sleep mode, which can reduce the battery capacity required for most applications by half and extend battery life.

 

     STMicroelectronics' third generation Bluetooth system chip, BlueNRG-LP, is the world's first Bluetooth LE 5.2 authentication system chip to support simultaneous connections to up to 128 nodes, allowing users to seamlessly and low-latency monitor a large number of connected devices, for example, Control your devices through a stylish and intuitive mobile app interface.

 

     With an RF output power of up to + 8dBm combined with a receive sensitivity of up to -104 DBM, BlueNRG-LP RF system chips now allow beacons, smart lamps, game consoles, building automation, industrial manufacturing and tracking applications to cover a greater range of communication. When you select a certified Bluetooth LE Mesh software solution from the resource-rich BlueNRG hardware and software ecosystem and seamlessly add it to the system, the communication distance can be extended indefinitely.

 

     In addition, BlueNRG-LP supports Bluetooth remote mode, uses forward error correction (FEC) coded physical layer (Code PHY) to extend wireless communication distance to hundreds of meters, and improves connection reliability; Connect devices quickly and efficiently with GATT (Universal Attribute) caching technology.

 

     BlueNRG-LP comes pre-loaded with ST's Core Specification 5.2 certified 3rd generation Bluetooth Low Energy stack that precisely matches its ultra-low power architecture. The stack is a free to use compiler-independent linkable library supported by multiple integrated development environments (ides). Features such as low code volume, modularity, low latency, interoperation and lifetime wireless upgrade, support for longer broadcast and scan packets, unconnectable broadcast with high occupancy ratio, longer packet length and 2Mbit/s throughput and other Bluetooth features.

 

     In addition, BlueNRG-LP supports L2CAP Connection-oriented Channel (CoC), which simplifies high-volume bidirectional data transfer and simultaneous multi-role connectivity, and Channel Selection Algorithm # 2 (CSA# 2), which allows robust connectivity in noisy environments such as home and building automation or industrial automation networks.

 

     The new product incorporates a number of enhanced security mechanisms in the integrated Arm® Cortex-M0 + microcontroller (MCU), including secure loaders, read protection for the entire 256KB embedded flash memory, 48-bit unique ID codes, As well as customer key storage, hardware random number generator (RNG), hardware Public Key Accelerator (PKA), and 128-bit AES cryptographic coprocessor. This is a highly efficient processing unit, with code execution speeds of up to 64MHz, but surprisingly low power consumption of 18µA/MHz. Features industry standard digital interface, multi-channel 12-bit ADC analog-to-digital converter, analog microphone interface with programmable gain amplifier, user timer and watchdog, system timer and watchdog, up to 31 user programmable 5V I/O pins.

 

     The BlueNRG-LP system chip also integrates embedded RF Barron, DC/DC converters, and capacitors for HSE (high speed external) oscillators and internal low speed ring oscillators to minimize bill of material (BOM) costs and simplify circuit design.

 

     BlueNRG-LP is available in three packages: 5mm x 5mm QFN32, 6mm x 6mm QFN48, and 3.14mm x 3.14mm WLCSP49 microwafer-level packages. With on-chip RAM capacity of 32KB or 64KB and operating temperatures up to 85°C or 105°C, designers have the flexibility to choose the most satisfactory configuration according to requirements. These products have been included in ST's 10-year supply guarantee program to ensure long-term availability to users.

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