STMicroelectronics introduces High performance Global shutter image sensor

     STMicroelectronics' advanced manufacturing process technology enables the new image sensor to have the smallest pixel size in its class with high sensitivity and low crosstalk. The combination of silicon process innovation and advanced pixel architecture makes the sensor pixel array on the front of the chip smaller, while leaving more silicon area on the back of the chip for increased digital processing capabilities and peripheral components.

     The new sensors are the 640 x 600 pixel VD55G0 and the 15 megapixel (1124 x 1364) VD56G3. With chip sizes of 2.6mm x 2.5mm and 3.6mm x 4.3mm, the VD55G0 and VD56G3 are the smallest on the market relative to resolution. Low crosstalk between pixels at all wavelengths, especially near infrared lighting conditions, ensures high contrast and excellent image clarity. The VD56G3's embedded optical flow processor can calculate motion vectors without the use of the main processor. The new sensors are suitable for a variety of applications, including augmented and virtual reality (AR/VR), simultaneous localization and mapping (SLAM), and 3D scanning.

     Eric Aussedat, Executive Vice President of STMicroelectronics Simulation, MEMS and Sensor Products and general manager of the Imaging Business Unit, said: "The new Global Shutter image sensor is based on our third generation of advanced pixel technology and significantly improves product performance, size and system integration, taking computer vision applications a major step forward and enabling designers to develop the autonomous intelligent industrial and consumer devices of the future."